Projected Capacitive Touchscreen

The PCAP (Projected Capacitive Touchscreen) technology (PCAP) is familiar to the majority of users when the iPhone is popular . The excellent experience of capacitive screen in user interaction has gradually increased from daily consumer products to automotive, industrial control, medical devices and other fields.

Chipswork has more than 15 years of experience in the design and production of PCAP, and we have had hundreds of successful cases in harsh use environments. We have the standard specifications available for users to choose from, and at the same time, we also support customizations.

Relying on the continuous investment in the field of PCAP technology, Chipswork has become the Design Partner of Microchip and the VAR (Value Added Reseller) of Infineon who is the worldwide leading touch HMI chips. We can provide complete technical services directly to our customers.

Key Features：

• √ Stacking structure：GG,GFF
• √ Size：1.0“~27”
• √ Function：Muti-fingers
• √ Support thick cover, glove and water proof touch
• √ IK 10 grade criteria
• √ I/O:I2C,USB,UART,RS232

Touch controller

Chipswork provides different touch controller options according to its design requirements.

Features：

Fine tuning & Service

In PCAP customized designs, the most critical technical problem is the debugging of firmware (Firmware) based on the customers’ system . Chipswork has a complete technical service team and rich debugging experience, which can independently face customer needs, independently complete debugging work, and shorten the research and development cycle of new projects .

The common debugging requirements, in addition to the regular touch function, often meet special requirements in different usage scenarios:

• √ EMC/EMI testing and qualification
• √ Thick glove touch
• √ Operation with moisture
• √ Unconventional touch design (buttons, circular touch, etc.)

In addition to the standard PCAPs , most customers will customize the specifications according to their own product design. Customization includes cover lens, sensor, FPC, touch controller. Chipswork has rich experience in product design and system debugging, we can provide customers the totally support during the the complete project cycle, including:

• √ User requirements analysis and solutions design
• √ Samples and prototype design and making
• √ Samples debugging and testing
• √ System driver development and applications supporting
• √ New materials and process evaluation
• √ High level assembly and testing service

Process

FPC bonding and cover lens bonding are the key process in the PCAP process which affect the stability of the module. In order to meet the requirements of customers for high quality standards but the small quantity requirements, we have set up the manufacturing process of PCAP, which can provide:

• √ High-level dust-free environment (up to 100 grade)
• √ FPC bonding
• √ G / G, G / F / F bonding
• √ UV welding
• √ Bubble off
• √ Function testing
• √ OCA Optical bonding (glass to glass)