The whole design of machine assembly system, the corresponding assembly process is required to assemble different components into the whole machine. In order to serve customers and help them solve the key assembly processes, we provide customers with different assembly processes, including Air Bonding, Optical Bonding and Box Building.
Air bonding is a low-cost bonding process . With the increasing requirements of touch panel bonding with display module, it is critical challenge how to effectively bonding the display with the touchscreen or protective cover . A typical air bonding module consists of multiple layers, such as a protective cover or a touch screen with an LCD screen. The material cost of the frame is low, but in order to ensure the yield of the lamination, the environmental requirements are very high, and the entire lamination assembly needs to be carried out in a clean room. The frame pasting process of Chipswork uses high-quality tapes such as 3M and tesa, and sets up special fixtures to be processed in the Class 100 duty-free room.
LCD displays are susceptible to glare and reflections from direct sunlight or high-brightness applications. Air bonding are traditional lamination techniques that create an air gap between the display and the touchscreen or cover, which causes the display to be refracted in a high-brightness environment, reducing the contrast and readability of the display. In order to reduce refraction inside these components, optical bonding solves the problem of air gaps between the individual components. The optical layer minimizes refraction, making the screen easier to see outdoors or in high-brightness conditions without increasing the brightness of the screen itself, resulting in better image quality. Optical bonding reduces the amount of ambient light reflected (i.e., increases contrast) and is combined with anti-glare (AG) and anti-reflection (AR) treatments on the cover to improve sunlight readability.
Our optical bonding is made of silicon-based gluve from WACKER, which ensures high reliability and stability.
Our customers focus on the development and production of high-quality equipment for vertical market applications, and as new technologies continue to pour into the industry application field, the original supply chain and production process are changed. In order to allow customers to focus on the research and development of core technologies and shorten the time to market of new products, Chipswork has invested in engineering and technical service teams and corresponding manufacturing and testing equipment to make it easy for customers to innovate new products.We can provide the following complete machine assembly services:
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